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In recognition of its commitment to providing reliable LEAD-FREE manufacturing solutions, Cal Quality
has been awarded LEAD-FREE process Validation from CE Analytics, a world leader in LEAD-FREE conversion
technologies. Cal Quality's LEAD-FREE initiative ensures the compliance of its manufacturing process,
without adversely affecting technical product specifications. The process was validated and the first
production units were shipped in May, which met all customer requirements necessary for the European
market, proving CQE's ability to provide safe, non-toxic solutions that satisfy LEAD-FREE standards.
Leaded solder used to affix electrical components to circuit boards has been a primary source of
lead content in electronics manufacturing. Because of its low melting temperature it has been used
for many years to minimize damage to components or the board itself. Now environmental restrictions
on hazardous substances such as lead are being legislated in order to improve safety and reduce
environmental hazards. Alternative materials without lead require significantly higher process
temperatures, more robust components and product redevelopment in order to meet the new
environmental standards.
While there is no current prohibition of its use in the electronics industry today, Europe and Japan
are in the process of eliminating lead by July 1, 2006. California has a goal to meet the NO-LEAD
requirement in January of 2007, and the LEAD-FREE process is expected to be phased into new electronic
equipment production in the United States over the next few years.
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Lead-Free Process Validation

Chip Component End Joint.
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